13.08.2012 h2a1 - h970 1 / 4 h2a1 - h970 high power single chip led h2a1 - h970 is a gaalas based, high power 970 nm single chip led in standard hexagonal aluminum package for general application. slots in the aluminum - core pcb allow for easy mounting of standard collimating optics and are also suitable for m3 or m4 mounting screws. large electrical interconnection pads on the pcb allow for convenient installation. specifications ? str ucture: gaalas ? peak wavelength: 970 nm ? optical output power: typ. 40 mw ? life time: > 10.000 hou rs ? lead free product - rohs compliant absolute maximum ratings (t a =25c) parameter symbol value unit power dissipation, dc p d 1000 mw forward current, dc i f 500 ma pulsed current (1% duty cycle, 1khz) i fp 1000 ma reverse voltage u r - 5 v operati ng temperature t opr - 30 ? +70 c storage temperature t stg - 30 ? +85 c soldering temperature (max. 1,5 s) t sol 330 c electro - optical characteristics (t a =25c) parameter symbol condition min. typ. max. unit forward current i f - 350 - ma viewing a ngle i f = 350 ma 75 d eg. cw output power p o i f = 350 ma 40 mw peak wavelength p i f = 350 ma - 970 - nm forward voltage u f i f = 350 ma - 1.4 - v half width (fwhm) ? i f = 350 ma - 27 nm rise time t r i f = 350 ma 40 ns fall time t f i f = 350 ma 40 ns wavelength measurements tolerance is +/ - 2% output power measurement tolerance is +/ - 10% voltage measurement tolerance is +/ - 2% device materials item material foundation plastic lens acryl electrodes agcu pcb al
13.08.2012 h2a1 - h970 2 / 4 typical performance characteristics normalized o utput p ower vs. wavelength : outline dimensions emitter:
13.08.2012 h2a1 - h970 3 / 4 radiation pattern (lambertian lens without optics) relative intensity vs. angular displacement accessories collimating optics, holders, reflectors 10158 + 10146, 2 half angle spot optic + optic holder 10048 + 10076, 4 half angle spot optic + optic holder 10003 + 10043, 6 half angle spot optic + optic holder 10003/15 + 10043 , 15 half angle spot optic + optic holder 10003/25 + 10043, 25 half angle spot optic + optic holder clp17cr, 6 metalized polycarbonate reflector clp23cr, 20 metalized polycarbonate reflector static electricity leds are very sensitive to static electricity and surge voltage. it is recommended to wear a wristband or an anti - electrostatic glove whenever handling the leds all devices, equipment , and machinery that is used when handling the leds must be ground ed properly. heat generation it is advised to operate these leds at a reasonable low temperature for long lifetime and stability. high operating temperature will result in premature degradation and shortened lifetime.
13.08.2012 h2a1 - h970 4 / 4 soldering conditions reflow soldering: apg2c1 leds have a maximum storage temperature of 85. therefor it is not possible to use a reflow soldering process for array assembly! hot bar soldering: a hot bar soldering process is recommended when soldering apg2c1 emitters. th is process will only transfer heat to the leads and avoids overheating the emitter which will damage the device. in order to transfer sufficient heat from the hot bar to the device, following parameters must be carefully considered: ? amount of flux ? pressing force of solder tip ? hot bar temperature for the standard assembly process, following parameters should be maintained: ? hot bar temperature: 330 c ? force of hot bar. 40 n ? soldering time: 1.5 s it is recommended to use a copper nickel - plated hot bar mounted to standard temperature controlled soldering equipment. manual hand soldering: for prototype build or small series production runs, it is possible to place and solder the emitters by hand. it is therefore recommended to maintain the following parameters: ? s older tip temperature 330 c ? soldering time. < 1.5 s ? junction temperature must be kept below 70 c a visual inspection may be used to check the quality of the solder joint general soldering precautions: ? mechanical stress, shock and vibration must be avoi ded during soldering ? only use non corrosive flux. ? do not apply current to the device until it has cooled down to room temperature after soldering.
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